Side wiring structure and manufacturing method thereof
US12369246B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 5, 2023 |
| Grant date | Jul 22, 2025 |
| Priority date | — |
| Expiry date | Apr 2, 2044 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/147
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A side wiring structure includes a first substrate, a first wiring structure, a first side wire, a first insulating adhesive structure, a second side wire, a first flexible circuit board, and a second flexible circuit board. The first wiring structure is located on a first surface of the first substrate. The first side wire extends from the first wiring structure on the first surface to the second surface along the side surface on the first substrate. The first insulating adhesive structure is located above the first side wire and extends from above the first surface of the first substrate to above the side surface of the first substrate. The first insulating adhesive structure is located between the first and second side wires. The first and second flexible circuit boards are electrically connected to the first and second side wires, respectively.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.