Multi-layer wave absorber structure and use thereof
US12369290B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 23, 2022 |
| Grant date | Jul 22, 2025 |
| Priority date | — |
| Expiry date | Sep 23, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K9/0088
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present disclosure relates to the technical field of microwave absorption, and in particular, to a multi-layer wave absorber structure and use thereof. The multi-layer wave absorber structure has a sandwich structure, and an intermediate layer of the sandwich structure is an electromagnetic loss-free dielectric layer. The electromagnetic loss-free dielectric layer includes a vacuum layer, an air layer, a paraffin layer, or a polytetrafluoroethylene layer. The added electromagnetic loss-free dielectric layer enhances impedance matching by modulating phases of electromagnetic waves, such that loss of the electromagnetic waves in a composite wave absorbing layer of the multi-layer wave absorber structure is enhanced, and an effective absorption bandwidth is further improved. The multi-layer wave absorber structure provided by the present disclosure has higher universality and operability, and has an effect of improving an effective absorption bandwidth for wave absorbing devices made of various composite wave absorbing materials.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.