Bonding method for electronic element
US12369430B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 27, 2021 |
| Grant date | Jul 22, 2025 |
| Priority date | — |
| Expiry date | Mar 10, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/857
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A bonding method for an electronic element includes attaching a solder film to a display substrate and covering multiple bonding pads, performing a heat treatment step so that a solder layer on the multiple bonding pads is transformed into multiple solder bumps, providing at least one electronic element and covering the solder bumps, and heating the solder bumps to electrically bond the at least one electronic element and the bonding pads. The display substrate includes multiple display panels, a first adhesive layer, and a glass cover. The first adhesive layer and the glass cover are disposed on one side of the display panel away from the bonding pads. During the bonding process of the at least one electronic element and the bonding pads, no pressure is applied between the at least one electronic element and the bonding pads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.