Manufacturing method of electronic device
US12370782B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 20, 2024 |
| Grant date | Jul 29, 2025 |
| Priority date | — |
| Expiry date | Jun 20, 2044 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB32B2457/20
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An manufacturing method of an electronic device includes: providing a first substrate and a second substrate; providing an adhesive member between the first substrate and the second substrate; providing a first curved element and a second curved element opposite to the first curved element; arranging the second substrate on a curved top surface of the second curved element; arranging the first substrate between the first curved element and the second substrate; and pressurizing the first curved element and the second curved element, so that the first substrate and the second substrate are attached to each other through the adhesive member, thereby forming a curved composite component; wherein the first substrate is flat before the step of pressurizing the first curved element and the second curved element, and the first substrate becomes curved after the step of pressurizing the first curved element and the second curved element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.