Hot-water moldable polyamide molding compositions
US12371566B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 7, 2020 |
| Grant date | Jul 29, 2025 |
| Priority date | — |
| Expiry date | Nov 25, 2042 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L77/06
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A polyamide molding composition (C) is provided and comprises at least one polyamide (P1) comprising recurring units (RPA) according to formula (I): Wherein n varies between 4 and 18, inclusive, and R1 is a mixture of m-xylylene (MX) and p-xylylene (PX) in a mol.% ratio varying between 1:99 and 99:1. The polyamide molding composition (C) further comprises at least one polymer (P2). The weight ratio of P1/P2 varies between 15/1 and 1/1 and polymer (P2) comprises recurring units (RPA2) according to formula (V): Wherein m varies between 6 and 18 and R1 is p-xylylene (PX). The polyamide molding compositing (C) optionally comprises at least one reinforcing agent, and/or at least one component selected from the group consisting of tougheners, plasticizers, colorants, pigments, antistatic agents, dyes, lubricants, thermal stabilizers, light stabilizers, flame retardants, nucleating agents and antioxidants.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.