Cutting path planning algorithm for semiconductor workpiece based on image processing
US12373933B2 · kind B2 · utility
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Key dates
| Filing date | Jun 7, 2024 |
| Grant date | Jul 29, 2025 |
| Priority date | — |
| Expiry date | Jun 7, 2044 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T2207/30164
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A cutting path planning algorithm for semiconductor workpiece based on image processing is provided, including the following steps: 1, obtaining a semantic boundary of an image; 2, finding a largest inscribed rectangle MRect in the single crystal image X1; 3. dividing the contour region in the single crystal region to find the corresponding cutting line; and 4. determining the final cutting line.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.