Member for semiconductor manufacturing apparatus
US12374534B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 1, 2023 |
| Grant date | Jul 29, 2025 |
| Priority date | — |
| Expiry date | Aug 19, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/2007
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A member for semiconductor manufacturing apparatus includes a ceramic plate incorporating an electrode; a ceramic plate through hole extending through the ceramic plate in an up-and-down direction; a base plate having electrical conductivity and located adjacent to a lower surface of the ceramic plate; a base plate through hole extending through the base plate in the up-and-down direction; an insulating sleeve inserted into the base plate through hole and having an outer circumferential surface adhered to an inner circumferential surface of the base plate through hole with an adhesive layer therebetween; and a sleeve through hole extending through the insulating sleeve in the up-and-down direction and communicating with the ceramic plate through hole, wherein the insulating sleeve has at least one ring-shaped or spiral outer circumferential groove on the outer circumferential surface of the insulating sleeve except for an upper end portion of the insulating sleeve.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.