Debonding tape and method of processing semiconductor wafer using the same
US12374575B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 22, 2022 |
| Grant date | Jul 29, 2025 |
| Priority date | — |
| Expiry date | May 9, 2044 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2221/68381
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A debonding tape includes a first tape layer including a first base layer having a first modulus and a first adhesive layer on the first base layer, wherein the first tape layer has a first diameter. The debonding tape includes a second tape layer on the first tape layer and supporting the first tape layer, wherein the second tape layer includes a second base layer on the first adhesive layer and having a second modulus greater than the first modulus, an intermediate layer on the second base layer, and a second adhesive layer on the intermediate layer. The second tape layer has a second diameter smaller than the first diameter such that a circumferential portion of the first tape layer is exposed in a cross-sectional view.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.