Hybrid chip carrier package
US12374608B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 13, 2022 |
| Grant date | Jul 29, 2025 |
| Priority date | — |
| Expiry date | Jan 30, 2044 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2223/6688
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic device includes a rectangular ceramic package structure having opposite first and second sides, an interior cavity that extends to an opening in the second side, opposite third and fourth sides spaced along a first direction, opposite fifth and sixth sides spaced along an orthogonal second direction, and non-conductive indents extending into the third and fourth sides. The device also includes a semiconductor die in the cavity, a lid that covers the opening and seals the cavity, a conductive terminal having a planar side exposed along the first side that is electrically coupled to a circuit of the semiconductor die and extends to a first one of the non-conductive indents, and conductive pins spaced apart from the conductive terminal and extending outward from the first side of the ceramic package structure along a third direction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.