Semiconductor devices and data storage systems including the same
US12374642B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 31, 2022 |
| Grant date | Jul 29, 2025 |
| Priority date | — |
| Expiry date | Feb 13, 2044 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14511
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes: a first substrate; circuit devices disposed on the first substrate; a lower interconnection structure electrically connected to the circuit devices; a lower bonding structure connected to the lower interconnection structure; an upper bonding structure bonded to the lower bonding structure; an upper interconnection structure connected to the upper bonding structure; a second substrate disposed on the upper interconnection structure; a conductive plate disposed below the second substrate; gate electrodes disposed between the upper interconnection structure and the conductive plate and stacked in a vertical direction; channel structures penetrating through the gate electrodes; a plurality of conductive patterns, respectively disposed in a plurality of openings penetrating through the second substrate; and a peripheral contact plug extending in the vertical direction in an external region from the conductive plate and being connected to one of the plurality of conductive patterns.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.