Die with metal pillars
US12374643B2 · kind B2 · utility
0Cited by
2References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 30, 2023 |
| Grant date | Jul 29, 2025 |
| Priority date | — |
| Expiry date | Oct 30, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2225/06513
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present disclosure relates to a die comprising metal pillars extending from a surface of the die, the height of each pillar being substantially equal to or greater than 20 μm, the pillars being intended to raise the die when fastening the die by means of a bonding material on a surface of a support. The metal pillars being inserted into the bonding material at which point the bonding material is annealed to be cured and hardened solidifying the bonding material to couple the die to the surface of the support.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.