Integrated manifold
US12374739B2 · kind B2 · utility
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2References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 14, 2022 |
| Grant date | Jul 29, 2025 |
| Priority date | — |
| Expiry date | May 11, 2044 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01M2220/20
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A fluid manifold for cooling systems has parallel inlets directing flow through a base of a nozzle to an outlet which is preferably parallel to the inlets. The pressure drop from the inlets to the outlet is preferably less than 3 psi and the inlets have inlet portions with check valves connected thereto.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.