Transversely-excited film bulk acoustic resonator filters with sub-resonators having different mark and pitch
US12375062B2 · kind B2 · utility
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36References
20Claims
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Key dates
| Filing date | Mar 28, 2024 |
| Grant date | Jul 29, 2025 |
| Priority date | — |
| Expiry date | Mar 28, 2044 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03H2003/023
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
Radio frequency filters are disclosed. A bandpass filter is discloses that includes one first bulk acoustic resonator on a first chip including a first piezoelectric layer having an LN-equivalent thickness less than or equal to 535 nm; a second bulk acoustic resonator on a second chip including a second piezoelectric layer having a thickness greater than the LN-equivalent thickness of the piezoelectric layer on the first chip; and a circuit card coupled to the first chip and the second chip and that electrically connects the first chip to the second chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.