Printed circuit board mesh routing to reduce solder ball joint failure during reflow
US12376226B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 5, 2021 |
| Grant date | Jul 29, 2025 |
| Priority date | — |
| Expiry date | Sep 7, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10734
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Voids are introduced in a copper shape to reduce warpage experienced by a printed circuit board during a reflow process. Copper shapes on an outer layer of a printed circuit board may be used to connect large packages that include ball grid arrays to the printed circuit board. The copper shapes may induce warpage in the printed circuit board during the reflow process. Routing a mesh pattern of voids in the copper shapes may reduce solder ball joint cracking and pad cratering during reflow and make solder joints more reliable. The voids may make the copper shapes less ridged and change the copper heat dissipation profile to remove sharp warpage forces that cause solder joints to experience pad cratering. The voids may be 8 mil×8 mil cuts or indentations in the copper shape.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.