Semiconductor device structure with magnetic element
US12376317B2 · kind B2 · utility
0Cited by
6References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 17, 2023 |
| Grant date | Jul 29, 2025 |
| Priority date | — |
| Expiry date | Oct 11, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/05
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device structure is provided. The semiconductor device structure includes a substrate and a magnetic element over the substrate. The semiconductor device structure also includes an isolation element partially covering the magnetic element. The semiconductor device structure further includes a conductive feature over the isolation element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.