Monocrystalline silicon micro-nano dual-scale anti-reflection texture and preparation method therefor
US12377578B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Sep 9, 2022 |
| Grant date | Aug 5, 2025 |
| Priority date | — |
| Expiry date | Jan 19, 2044 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A monocrystalline silicon micro-nano dual-scale anti-reflection texture and a preparation method therefor. The preparation method combines nanosecond-laser-assisted waterjet near-damage-free processing and femtosecond laser scanning, and subsurface damage caused by a re-cast layer phenomenon and a hot crack in a monocrystalline silicon laser texturing process can be effectively reduced by combining a nanosecond-laser-assisted waterjet near-damage-free processing technology and an ultra-short pulse femtosecond laser cold processing technology; and meanwhile, a micro-scale frame structure and a nano-scale structure can be flexibly modified respectively by adjusting nanosecond-laser-assisted waterjet technological parameters and femtosecond laser technological parameters, a geometry light trapping effect and an effective dielectric effect can be achieved in a micro-nano dual-scale hybrid structure at the same time, and surface reflection is reduced.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.