Silica sol having particle size distribution and production method therefor
US12378127B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 13, 2023 |
| Grant date | Aug 5, 2025 |
| Priority date | — |
| Expiry date | Jan 13, 2043 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K2201/003
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A silica sol including silica particles exhibiting an average particle diameter distribution having at least two peaks, the silica sol being characterized in that the at least two peaks include the largest peak a, in a range of D50-D90, being present in a range of 35-200 nm, and the largest peak b, in a range of D10-D50, being present in a range from 5 nm to less than 35 nm, and that the surfaces of at least some of silica particles include an organic group bonded directly to a silicon atom via an Si—C bond, and an alkoxy group including a methoxy group or an ethoxy group, wherein the alkoxy group is bonded to the surface of the silica particles at a ratio of 0.6-3.0 alkoxy groups/nm2.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.