Polyamides and corresponding polymer compositions and articles
US12378357B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 7, 2020 |
| Grant date | Aug 5, 2025 |
| Priority date | — |
| Expiry date | Aug 24, 2042 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K7/14
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Described herein are polyamides (PA) derived from the polycondensation of monomers in a reaction mixture comprising: (1) a diamine component (A) comprising 20 mol % to 95 mol % of a C4 to C12 aliphatic diamine, and 5 mol % to 80 mol % of a bis(aminoalkyl)cyclohexane, where mol % is relative to the total number of moles of all diamine monomers in the diamine component; and a dicarboxylic acid component (B) comprising: 30 mol % to 99 mol % of terephthalic acid and 1 mol % to 70 mol % of a cyclohexane dicarboxylic acid, wherein mol % is relative to the total number of moles of all dicarboxylic acid monomers in the dicarboxylic acid component. It was surprisingly discovered that, with the particular combination of the bis(aminoalkyl)cyclohexane and the cyclohexanedicarboxylic acid, the polyamides (PA) had, on the whole, improved thermal performance relative to analogous polyamides, in which the cyclohexanedicarboxylic acid is replaced with an aromatic dicarboxylic acid.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.