Self-sensitizing negative polyimide precursor and method for preparing the same, and use thereof
US12378361B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | May 12, 2025 |
| Grant date | Aug 5, 2025 |
| Priority date | — |
| Expiry date | May 12, 2045 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G73/1067
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A self-sensitizing negative polyimide precursor and a method for preparing the same, and use thereof. 4,4′-dinitro-1,1′-biphenyl-2,2′-dicarboxylic acid is used as a starting material and undergoes an acylation reaction with thionyl chloride to afford compound 1. Compound 1 subsequently undergoes an esterification reaction with 2-hydroxyethyl methacrylate to afford compound 2. The nitro groups of compound 2 are then reduced to amino groups; after purification, an intermediate of the self-sensitizing negative polyimide precursor is obtained. The intermediate is polymerized with 3,3′,4,4′-benzophenone tetracarboxylic dianhydride to give a polyamic acid, namely the self-sensitizing negative polyimide precursor. Because the intermediate contains a benzophenone moiety, ultraviolet irradiation can generate free radicals, allowing the intermediate to act intrinsically as a photoinitiator. The dual photosensitive properties of the ketone carbonyl and double bond in the self-sensitizing negative polyimide precursor material provided by the present application can improve the exposure sensitivity of the resin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.