Curable organopolysiloxane composition, cured product, and electric/electronic equipment
US12378414B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Jul 26, 2019 |
| Grant date | Aug 5, 2025 |
| Priority date | — |
| Expiry date | Sep 30, 2041 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2205/035
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A curable organopolysiloxane composition is provided. The curable organopolysiloxane composition comprises: (A) an organopolysiloxane having at least two alkenyl groups per molecule; (B) an organosiloxane having one silicon atom-bonded hydrogen atom per molecule and free of alkenyl groups and silicon atom-bonded alkoxy groups; (C) an organosiloxane having one silicon atom-bonded hydrogen atom and at least one silicon atom-bonded alkoxy group per molecule and free of alkenyl groups; (D) an organopolysiloxane having at least two silicon atom-bonded hydrogen atoms per molecule and free of alkenyl groups and silicon atom-bonded alkoxy groups; (E) a hydrosilylation reaction catalyst; and (F) a condensation reaction catalyst. The curable organopolysiloxane composition can be cured to form a cured product. The cured product generally exhibits an excellent adhesion property against various substrates without cracking and delamination occurring after a thermal shock test.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.