Thermal bus structure for a magnetic resonance imaging device
US12379435B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 29, 2023 |
| Grant date | Aug 5, 2025 |
| Priority date | — |
| Expiry date | Nov 16, 2043 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R33/3802
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The disclosure relates to a magnetic resonance imaging device comprising a main magnet, a gradient system including at least one gradient coil, a thermal bus structure, a shield structure arranged between the gradient system and the main magnet and a cryocooler including a cold head, wherein the shield structure is configured to reduce a transport of heat energy to the main magnet and wherein the main magnet comprises a magnet spacer configured for spacing individual coils of the main magnet, wherein the thermal bus structure comprises at least one thermal bus element extending through the magnet spacer for providing a thermal connection between the cold head of the cryocooler and the shield structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.