Adhesion promoting photoresist underlayer composition
US12379660B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 18, 2020 |
| Grant date | Aug 5, 2025 |
| Priority date | — |
| Expiry date | Sep 22, 2043 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K5/19
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A photoresist underlayer composition comprising a poly(arylene ether); an additive of formula (14): D-(L1-Ar—[X]n)m (14); and a solvent, wherein, in formula (14), D is a substituted or unsubstituted C1-60 organic group, optionally wherein D is an organic acid salt of the substituted or unsubstituted C1-60 organic group; each L1 is independently a single bond or a divalent linking group, when L1 is a single bond, D may be a substituted or unsubstituted C3-30 cycloalkyl or substituted or unsubstituted C1-20 heterocycloalkyl that is optionally fused with Ar, each Ar is independently a monocyclic or polycyclic C5-60 aromatic group, each X is independently —OR30, —SR31, or —NR32R33, m is an integer of 1 to 6, each n is independently an integer of 0 to 5, provided that a sum of all n is 2 or greater, and R30 to R33 are as provided herein.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.