System, apparatus and method for dynamic thermal distribution of a system on chip
US12379769B2 · kind B2 · utility
0Cited by
31References
18Claims
0Family size
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Key dates
| Filing date | Apr 6, 2023 |
| Grant date | Aug 5, 2025 |
| Priority date | — |
| Expiry date | Jul 27, 2043 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02D10/00
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
In one embodiment, a processor includes: a first plurality of intellectual property (IP) circuits to execute operations; and a second plurality of integrated voltage regulators, where the second plurality of integrated voltage regulators are oversubscribed with respect to the first plurality of IP circuits. Other embodiments are described and claimed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.