Package structure with fan-out feature
US12381114B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 27, 2023 |
| Grant date | Aug 5, 2025 |
| Priority date | — |
| Expiry date | Jul 27, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3512
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A package structure includes a first semiconductor die having a first conductive pad and a second semiconductor die having a second conductive pad. The package structure also includes a conductive structure and a third semiconductor die. The third semiconductor die extends across a portions of the first semiconductor die and the second semiconductor die. A third conductive pad and a fourth conductive pad of the third semiconductor die are aligned with the first conductive pad and the second conductive pad, respectively. The package structure further includes a protective layer surrounding the conductive structure and the third semiconductor die and an insulating layer extending across an interface between the protective layer and the conductive structure. The package structure includes a conductive layer electrically connected to the conductive structure. The conductive layer has a first portion spaced from the conductive structure and a second portion directly above the conductive structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.