Lead frame and manufacturing method thereof
US12381136B2 · kind B2 · utility
0Cited by
5References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 30, 2024 |
| Grant date | Aug 5, 2025 |
| Priority date | — |
| Expiry date | May 30, 2044 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0307
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A lead frame includes a plurality of lead portions. At least a part of an upper surface of the lead portion and a sidewall surface of the lead portion is a rough surface having been subjected to roughening treatment. A value of a* in a CIELab color space of the rough surface is within a range from 12 to 19, and a value of b* is within a range from 12 to 17.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.