Redistribution substrate and semiconductor package including the same
US12381156B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 2, 2022 |
| Grant date | Aug 5, 2025 |
| Priority date | — |
| Expiry date | Feb 16, 2044 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/35121
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A redistribution substrate may include a first interconnection layer having a first insulating pattern, a first dummy pattern and a second dummy pattern, the first and second dummy patterns being in the first insulating pattern, and a second interconnection layer stacked on the first interconnection layer, the second interconnection layer having a second insulating pattern, a signal pattern and a power/ground pattern, the signal and power/ground patterns being in the second insulating pattern. The first dummy pattern may be located below the signal pattern, and the second dummy pattern may be located below the power/ground pattern. The first dummy pattern may include dot patterns, and the second dummy pattern may include a plate pattern.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.