Solderless or groundless electromagnetic shielding in electronic devices
US12382575B2 · kind B2 · utility
0Cited by
16References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 23, 2021 |
| Grant date | Aug 5, 2025 |
| Priority date | — |
| Expiry date | Oct 26, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1311
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An example electronic device is disclosed that includes a printed circuit board, an electronic component coupled to the printed circuit board, and a solderless shield coupled to the printed circuit board and covering the electronic component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.