Printed circuit board and optoelectronic module providing different chip orientation
US12382584B2 · kind B2 · utility
0Cited by
3References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 8, 2023 |
| Grant date | Aug 5, 2025 |
| Priority date | — |
| Expiry date | Mar 22, 2044 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10121
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A printed circuit board (PCB) having a lateral extent and comprising a side landing pad for direct bonding of an optoelectronic chip, whereby the side landing pad comprises at least two landing areas being differently oriented with regard to the lateral, thus enabling a bonding of the chip in at least two different lateral orientations relative to the printed circuit board, whereby the electrical connection lengths of the landing areas are equal, and an optoelectronic module based on such a printed circuit board and an according time of flight camera.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.