Electronic device housing, manufacturing method thereof, and electronic device
US12382600B2 · kind B2 · utility
0Cited by
2References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 29, 2019 |
| Grant date | Aug 5, 2025 |
| Priority date | — |
| Expiry date | Oct 11, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04M1/0264
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
An electronic device housing, a manufacturing method thereof, and an electronic device are provided. The housing includes a bottom plate, and a middle frame connected to the bottom plate. The middle frame is made of glass, and the bottom plate is made of sapphire; or the bottom plate is made of glass, and the middle frame is made of sapphire. An interface-free continuous connection is provided between the bottom plate and the middle frame.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.