Patent · US Active

Substrate cutting and separating systems and methods

US12383985B2 · kind B2 · utility

0Cited by

1References

19Claims

0Family size

Assignee

CORNING INCORPORATED · US

Inventors

Andreas Simon Gaab · Gröbenzell, DE
Richard Anthony Gaona · Novato, US
Nicolai Martin Haenel · Bayern, DE
Dale Humphrey · Santa Rosa, US
Ralf Joachim Terbrueggen · Dundenheim, DE
John Tyler · Detroit, US

Key dates

Filing date	Dec 17, 2021
Grant date	Aug 12, 2025
Priority date	—
Expiry date	Jun 14, 2043

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY02P40/57
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

A method of forming a plurality of defects within a substrate with a laser beam focal line using a laser beam, each defect of the plurality of defects being a damage track within the substrate with a diameter of about 10 microns or less, the plurality of defects forming a contour line on the substrate. The substrate having a first surface and a second surface that is opposite from the first surface. The method further includes exerting (i) a first force on the first surface of the substrate at a location that is adjacent to the contour line and (ii) a second force on the second surface of the substrate at a location that is on the contour line. Additionally, the method includes breaking the substrate along the contour line and into a first substrate portion and a second substrate portion.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.