Composite pad for chemical mechanical polishing
US12384002B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 21, 2022 |
| Grant date | Aug 12, 2025 |
| Priority date | — |
| Expiry date | Jan 19, 2044 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L75/04
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A chemical mechanical polishing pad comprising a substantially non-porous polishing layer, the polishing layer comprising a polymer matrix and agglomerates of polymer particles embedded in the polymer matrix wherein the polymer particles are present in amounts of 5 to 35 weight percent based on weight of the polishing layer, the agglomerates have a size of greater than 1 μm, the polymer particles have a tensile modulus higher than a tensile modulus of the polymer matrix. The polishing layer viscoelastic and has a GEL of greater than 1000 Pa−1. Polishing a metal/insulator composite with such a pad can result in low amounts of dishing of the metal feature.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.