Low-melting copolyamide powders
US12384936B2 · kind B2 · utility
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2References
22Claims
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Key dates
| Filing date | Oct 23, 2019 |
| Grant date | Aug 12, 2025 |
| Priority date | — |
| Expiry date | May 26, 2041 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09D177/00
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A copolyamide-based powder intended for forming a coating on a surface, having an inherent viscosity of greater than or equal to 0.8 (g/100 g)−1, in which the copolyamide has a melting point of less than or equal to 160° C. Also, the use of such a powder for coating a surface, the coating having an inherent viscosity of greater than or equal to 0.8 (g/100 g)−1, and also a process for coating a surface using such a powder.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.