Heat-dissipating composition, heat-dissipating member, and filler aggregate for heat-dissipating member
US12384950B2 · kind B2 · utility
0Cited by
4References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 31, 2019 |
| Grant date | Aug 12, 2025 |
| Priority date | — |
| Expiry date | Jul 26, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/42
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The heat-dissipating composition according to the present invention comprises a polymer matrix and diamond particles. The present invention provides the heat-dissipating composition compatibly satisfying both electric insulativity and heat dissipativity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.