Method and apparatus for measuring electromigration of solder joint
US12385986B2 · kind B2 · utility
0Cited by
3References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 25, 2021 |
| Grant date | Aug 12, 2025 |
| Priority date | — |
| Expiry date | Jun 10, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L22/00
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Disclosed are a method and an apparatus for measuring electromigration of solder joints. The method includes: determining, according to voltage test pads led out from both ends of one or more solder joints, a voltage of a daisy subchain between the one or more solder joints (S502); and determining, according to the voltage, a resistance of the one or more solder joints (S504).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.