Negative-type photosensitive resin composition and method for producing polyimide and cured relief pattern using same
US12386259B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 18, 2019 |
| Grant date | Aug 12, 2025 |
| Priority date | — |
| Expiry date | Jun 23, 2042 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/40
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Provided are a negative photosensitive resin composition and a method for forming a cured relief pattern using the same with which a high chemical resistance and resolution can be obtained and in which the occurrence of voids in the interface of a Cu layer contacting a resin layer after high-temperature storage evaluation can be suppressed. Provided is a negative photosensitive resin composition including (A) a polyimide precursor represented by general formula (1) below; (B) a compound having at least one selected from a urethane bond and a urea bond; and (C) a photopolymerization initiator. In the formula, X1, Y1, n1, R1, and R2 are each as defined in the description of the present application.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.