Patent · US Active

Business form and methods of making and using same

US12387626B1 · kind B1 · utility

0Cited by
178References
20Claims
0Family size

Assignee

Inventors

Key dates

Filing dateFeb 21, 2023
Grant dateAug 12, 2025
Priority date
Expiry dateFeb 23, 2044

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T156/10
  • WIPO fieldAudio-visual technology
  • WIPO sectorElectrical engineering

Abstract

Business forms comprises control bond adhesive and methods of making and using same. A method of making a business form includes using a control bond adhesive created by mixing: (i) a first quantity of an adhesive; (ii) a second quantity of water; (iii) a third quantity of gypsum; and (iv) a fourth quantity of fumed silica. The method includes removably securing a first portion of said business form to a second portion of said business form.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.