Suspension damping
US12387752B2 · kind B2 · utility
0Cited by
31References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 8, 2024 |
| Grant date | Aug 12, 2025 |
| Priority date | — |
| Expiry date | May 8, 2044 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11B5/486
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A dielectric layer configured to overlay a spring metal layer in a suspension assembly is described. The dielectric layer includes a tongue portion including a proximate end and a distal end, trace portions extending from the tongue portion, and an aperture aligned with the void and defined by the tongue portion. The aperture includes an elongated opening with opposing ends partially aligning with the central opening of the void. The aperture further includes slits extending from the opposing ends of the elongated opening and at least partially aligned with slits of the void in the spring metal layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.