Semiconductor packages
US12387997B2 · kind B2 · utility
0Cited by
10References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 1, 2022 |
| Grant date | Aug 12, 2025 |
| Priority date | — |
| Expiry date | Jun 13, 2044 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1632
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor package includes a first integrated circuit, a plurality of first through vias and a plurality of fin-shaped through vias. The first through vias surround the first integrated circuit. The fin-shaped through vias are physically connected to the first through vias respectively, wherein the first through vias are disposed between the first integrated circuit and the fin-shaped through vias.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.