Electronic device with multiple resin layers reducing suppression in reliability
US12388043B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jul 8, 2022 |
| Grant date | Aug 12, 2025 |
| Priority date | — |
| Expiry date | Jun 5, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19102
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present disclosure provides an electronic device. The electronic device includes a first resin layer, having a first resin layer main surface and a first resin layer inner surface; a first conductor, having a first conductor main surface and a first conductor inner surface; a first wiring layer, formed adjacent to the first resin layer main surface and connected to the first conductor main surface; a first electronic component, electrically connected with the first wiring layer; a second resin layer, having a second resin layer main surface facing same direction as the first resin layer main surface and a second resin layer inner surface being in contact with the first resin layer main surface; an external electrode; and a second conductor, penetrating the second resin layer, wherein the second conductor is disposed on a periphery of the first electronic component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.