Patent · US Active

Barriers for grooves in photonics dies

US12388051B2 · kind B2 · utility

0Cited by

4References

22Claims

0Family size

Assignee

Intel Corporation · US

Inventors

Xiaoqian Li · Chandler, US
Wei Li · Shanghai, CN
Santosh Shaw · Chandler, US
Jingyi Huang · Chandler, US

Key dates

Filing date	Mar 26, 2021
Grant date	Aug 12, 2025
Priority date	—
Expiry date	Oct 3, 2043

Classification

Technology area (CPC H)Electricity
CPC primaryH10H20/857
WIPO fieldOptics
WIPO sectorInstruments

Abstract

Embodiments disclosed herein include photonics packages. In an embodiment, a photonics package includes a photonics die and a plurality of v-grooves on the photonics die. A barrier structure proximate the plurality of v-grooves.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.