Wire module and manufacturing method thereof
US12388227B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 3, 2023 |
| Grant date | Aug 12, 2025 |
| Priority date | — |
| Expiry date | Apr 3, 2044 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10606
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A wire module is disclosed, which includes a wire group and a wire-distributing device. The wire group has a plurality of wires. The wire-distributing device includes a first wire-distributing module and a second wire-distributing module. The first wire-distributing module has a first wire-distributing member and a first sectional surface. The first sectional surface is located on the surface of one end of the first wire-distributing member, and the first part of the plurality of wires is positioned side by side on the first wire-distributing member. The second wire-distributing module has similar structures and configurations to the first wire-distributing module, wherein the first wire-distributing module is stacked on the second wire-distributing module, and the first sectional surface and the second sectional surface are correspondingly located on the same side.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.