Heat dissipation apparatus and electronic device
US12389523B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 29, 2021 |
| Grant date | Aug 12, 2025 |
| Priority date | — |
| Expiry date | Aug 23, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/042
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An example heat dissipation apparatus is connected to a heat sink. The example heat dissipation apparatus includes a first circuit board, a second circuit board, a support post, a main heat generation component, and a thermal conductive assembly. The second circuit board is located on a side of the first circuit board, and is spaced from the first circuit board. The support post is connected between the first circuit board and the second circuit board to form an air layer between the first circuit board and the second circuit board. The main heat generation component is mounted on the second circuit board. The thermal conductive assembly is connected between a second thermal conductive layer of the first circuit board and a third thermal conductive layer of the second circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.