Electronic circuit
US12389526B2 · kind B2 · utility
0Cited by
2References
24Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 8, 2022 |
| Grant date | Aug 12, 2025 |
| Priority date | — |
| Expiry date | Jun 30, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/06
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic circuit includes an upper substrate and a lower substrate. An electronic integrated circuit chip is positioned between the upper and lower substrates. The chip includes contact elements coupled to the upper substrate. A first region made of a first material is arranged between the chip and a heat transfer area crossing the lower substrate. A second region filled with a second material couples the lower and upper substrates and laterally surrounds the first region. The first material has a thermal conductivity greater than a thermal conductivity of the second material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.