Inline monitoring system for process defects during manufacturing
US12389550B1 · kind B1 · utility
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20Claims
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Key dates
| Filing date | Feb 14, 2025 |
| Grant date | Aug 12, 2025 |
| Priority date | — |
| Expiry date | Feb 14, 2045 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/163
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Systems and methods are provided for inline process monitoring (e.g., remote inline process monitoring) for scalable and precision high-yield manufacturing. Antenna probes, such as millimeter (mm) wave (mmWave) antenna (mWA) probes, can be introduced into fabrication equipment to reveal the nature of hidden conductor and/or dielectric defects, as well as via-pad and/or device pad-trace misalignments, going beyond automated optical inspection (AOI) or contact probing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.