Inverter having heat conducting component
US12389574B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 17, 2023 |
| Grant date | Aug 12, 2025 |
| Priority date | — |
| Expiry date | Sep 2, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10166
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present application relates to the technical field of semiconductor, and in particular to an inverter. The inverter provided by the present application includes a substrate, a discrete device and a heat conducting component. The discrete device and the heat conducting component are both arranged on the substrate. A part of the heat conducting component is located in an area of the substrate where the discrete device is provided, and another part of the heat conducting component is located in an area of the substrate where the discrete device is not provided. The heat conducting component may rapidly transfer the heat of the overheated area of the substrate where the discrete device is mounted to the less hot area of the substrate, and promote the heat generated by the discrete device to spread evenly to the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.