Cleaning systems for wire bonding tools, wire bonding machines including such systems, and related methods
US12390839B2 · kind B2 · utility
0Cited by
5References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 30, 2019 |
| Grant date | Aug 19, 2025 |
| Priority date | — |
| Expiry date | Jan 30, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/00014
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
A method of cleaning a tip of a wire bonding tool on a wire bonding machine is provided. The method includes the steps of: (a) moving a wire away from the wire bonding tool such that the tip of the wire bonding tool is accessible to a cleaning station of the wire bonding machine; and (b) cleaning at least a portion of the tip of the wire bonding tool with the cleaning station after step (a).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.