Dual type ultrasonic bonding apparatus and bonding method using the same
US12390879B2 · kind B2 · utility
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3Claims
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Key dates
| Filing date | Mar 17, 2023 |
| Grant date | Aug 19, 2025 |
| Priority date | — |
| Expiry date | Jul 27, 2043 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K20/26
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Disclosed is a dual heating type ultrasonic bonding apparatus including a stage, a part seating jig disposed on the stage, and an ultrasonic bonding unit disposed to correspond to the part seating jig and that bonds dissimilar parts seated on the part seating jig. The stage includes a first heater that transfers heat to the dissimilar parts through the part seating jig, and the ultrasonic bonding unit includes an ultrasonic horn that applies ultrasonic waves to the dissimilar parts, and a second heater coupled to the ultrasonic horn, and that transfers heat to the dissimilar parts through the ultrasonic horn.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.