Heating device
US12390970B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 7, 2022 |
| Grant date | Aug 19, 2025 |
| Priority date | — |
| Expiry date | Mar 2, 2042 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C2945/7626
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Heating device for locally heating of an injection mold cavity wall, comprising: a base plate, an actuator located on the base plate, to perform a linear movement; a heated stamp connected to the actuator and driven by the actuator, to perform a linear movement in direction to and from the injection mold cavity wall; wherein the heated stamp is located below the base plate and the actuator is located on top of the base plate, and wherein the base plate comprises an opening through which a pin extends for transferring the linear movement from the actuator to the heated stamp.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.