Patent · US Active

Hermetically sealed transparent cavity and package for same

US12391544B2 · kind B2 · utility

0Cited by

4References

8Claims

0Family size

Assignee

Schott AG · DE

Inventors

Thomas Zetterer · Bad Kreuznach, DE
Antti Määttänen
Jens Ulrich Thomas · Mainz, DE
Robert Hettler · Kumhausen, DE
Yutaka Onezawa · Otsu, JP

Key dates

Filing date	Jul 14, 2022
Grant date	Aug 19, 2025
Priority date	—
Expiry date	Jan 28, 2043

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB81C2203/0118
WIPO fieldMicro-structural and nano-technology
WIPO sectorChemistry

Abstract

A method for providing a plurality of hermetically sealed packages, including the steps of: providing at least two substrates including a first substrate and a second substrate, at least one of the at least two substrates being a transparent substrate, the two substrates being arranged directly adjoining each other or on top of one another, the transparent substrate defining a circumferential rim and an upper side of each package, the bottom of the package being defined by the second substrate, a respective contact area being defined at contact surfaces between the two substrates; sealing each functional area in a hermetically tight manner by bonding the two substrates along the contact area of each package; and dicing each package by a cutting step or a separating step, a particle jet being used to abrasively remove a material from the transparent substrate by the particle jet.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.