Dielectric substrate and method of forming the same
US12391850B2 · kind B2 · utility
0Cited by
45References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 9, 2021 |
| Grant date | Aug 19, 2025 |
| Priority date | — |
| Expiry date | Dec 9, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/068
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present disclosure relates to a dielectric substrate that may include a first fluoropolymer based adhesive layer, a polyimide layer overlying the fluoropolymer based adhesive layer, and a first filled polymer layer overlying the polyimide layer. The first filled polymer layer may include a resin matrix component, and a first ceramic filler component. The first ceramic filler component may include a first filler material. The first filler material may further have a mean particle size of at not greater than about 10 microns.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.